Workpiece processed: silicon wafer of discrete devices, integrated chips and virgin etc.
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Applications: back thining , rough grinding and fine grinding.
Note: Other speifications are available according to your requirements.
Packaging & Shipping
Henan Yinwang Trade Co., Ltd. is a high-tech company mainly engaged in abrasive tools and relevant products. Being the first class in superabrasive industry is our lasting aim. We have scientific management idea, perfect management procedure and excellent team, which guarantee the leading position of our products in this industry. We can meet different needs of different clients.