Superthin diamond blade for cutting BGA has the following features:
1. High precision
2. Long life span
3. Strong hold of grits
4. Slight cutting depth
5. Good wear resistance
6. Good shape keeping ability
Metal bond diamond cutting blade without steel core is mainly used to groove and cut BGA (semiconductor componenets).
1A8/2 (without water slot): 76.2*0.35*40
Note: Other specifications can be produced according to customers' requirements.
Packaging & Shipping
Henan Yinwang Trade Co., Ltd. is a high-tech company mainly engaged in abrasive tools and related products. Being the first class in superabrasive industry is our lasting aim. We have scientific management idea, perfect management procedure and excellent team, which guarantee the leading position of our products in this industry. We can meet different needs of different clients.
Adhering to the motto of "build the business on mutual trust and benefit", we endeavor to provide our customers with reliable products, comprehensive service and rewarding return.
We welcome customers, business associations and friends from all over the world to contact us and seek cooperation for mutual benefits.